uClamp3311PQ
The μClamp3311PQ transient voltage suppressor is specifically designed to protect sensitive components which are connected to low-voltage data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (cable discharge events), and EFT (electrical fast transients). It is rated to Grade 3 of AEC-Q100 for use in automotive applications.
Features
- Transient protection for data lines to
- IEC 61000-4-2 (ESD) ±25kV (air), ±20kV (contact)
- IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
- Cable Discharge Event (CDE)
- Qualified to AEC-Q100, Grade 3
- Protects one data line
- 低班mping voltage
- Working voltage: 3.3V
- Low leakage current
- Solid-state silicon-avalanche technology
- Pb-Free, Halogen Free, RoHS/WEEE Compliant
- Automotive Applications
- Low Voltage Data Lines
- 10/100 Ethernet
Applications
Packaging
- SLP1006P2
Order Codes
- uClamp3311PQ.TCT
Distributor/Catalog Supplier Inventory
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(-40°C to +85°C / 4000 cycles)
(50°C, 4000 Hrs)
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Resources
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Since its initiation in the early 20th century, the automotive industry has evolved significantly, adopting many innovations, changes and adaptations. Modern cars feature sophisticated capabilities such as the backup camera, a full-featured infotainment system, smartphone docks, GPS navigation, Bluetooth connectivity, and several other advanced features. Not only that, some of the recent car models are capable of autonomous driving, forward and rear collision detection, and autonomous parking. It is easily imaginable that the numbers of electronic components used in a vehicle are proliferating. At the same time, the requirement for miniaturization of the electronic components is becoming critical to make space for new components.
The semiconductor industry is producing leadless packages of integrated circuits (ICs) to make room for the enormous number of electronic components and meet modern-day vehicles' safety and reliability requirements. A big challenge is the lack of visibility of the solder joints on the printed circuit boards (PCBs) during the post package assembly process. The connections are beneath the package and are not visible from the top and the side. So you cannot say for sure if the IC is adequately bonded to the PCB or not. Original equipment manufacturers (OEMs) have been using X-ray machines to detect unreliable solder joints. It is expensive and time-consuming to do so.
Moreover, this has not proven effective with multilayer boards or boards with complex layouts and routing procedures. Each vehicle PCB has to go through a strict automatic visual inspection (AVI) post assembly to comply with safety and reliability standards. The goal is to ensure that every electrical joint is adequately soldered and connections are reliable.
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READ NOW当设计一个电子系统,往往有限rlooked and underestimated subject of protection must be considered. In some cases, the designer may be working to meet a certain standard such as IEC 61000-4-2 for electrostatic discharge (ESD) immunity. Equipment which is installed in harsh operating environments, such as remote meters, robotics and telecommunications systems, will require higher levels of lightning protection. These are somewhat obvious requirements. Other protection concerns include short circuits, voltage spikes, dirty power, cable discharge events, and so on. With all these transient threats, a designer may become overwhelmed and ask:how much protection is enough to ensure a reliable system?
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